Electroplating systems
Our aim is to continually enhance the functionality of components through innovative, eco-friendly and low-cost finishing solutions - and hence to contribute to our customers' success. Therefore, we have developed electroplating systems which perform complex functions to perfection:
 Gold |
Fine Gold, steel gold, Au/Ni, Au/Co, Au/Fe |
| Gold |
For thin wire bonding |
| Auronip |
Nickel phosphorous + Au |
| Palladium |
100%pure, also as bonding surface |
| Palladium/Nickel |
80/20 |
| Silver |
Unpolished, semi-polished and polished |
| Indium/Silver-Tin alloy etc. |
Further special alloy based on customer requirement for press-fit applications |
| Nickel |
Sulphamate unpolished or polished |
| Nickel-Phosphorus |
electrolytical or chemical, also as bonding surface |
| Copper |
Cyanide or acid |
| Tin |
100%pure, electrolytical or chemical, 90/10 or 95/5, etc, all either polished or unpolished |
| Multi-layer systems |